Table of Contents
Shenzen Uascent UAM087-Matter User Manual
(2A68EJX-UAM08)
Overview
Introduction
UAMO087 is a cost-effective WIFI+BLE module developed by Uascent Technology. It supports Bluetooth dual mode 5.2 and IEEE 802.11 b/g/n protocol standards, a lightweight TCP/IP protocol stack, STA, AP, and Direct modes, as well as the Matter protocol. Users can use this module to add networking functions to existing devices or build independent network controllers.
Features
- Supports 20 MHz channel.
- Standard IEEE 802.11b/g/n.
- Support WiFi+Bluetooth 5.2.
- Support STBC.
- Built-in low-power 32-bit MCU speed up to 160MHz, can be used as an applicationm processor.
- Support STA and AP and Direct working modes.
- Support BLE 1 Mbps.
Recommended Operating Rating
| Description | Min | Typ. | Max | Unit | |
| Ambient Temperature (TA) | -40 | 25 | 85 | def.C | |
| Vcc | 3.0 | 3.3 | 3.6 | V | |
| (VOL) | Output low voltage | VSS | VSS+0.3 | V | |
| (VOH) | output high voltage | VCC-0.3 | VCC | V |
Reference power consumption for conventional continuous operation
| Parameter | Condition / Notes | Typ. | Unit |
| TX Mode | |||
| |RF | 11b 11M | 270 | mA |
| |RF | 11b 54M | 240 | mA |
| |RF | 11n HT20 MCS7 | 230 | mA |
| RX Mode | |||
| |RF | 11b 11M | 80 | mA |
| |RF | 11b 11M | 80 | mA |
| |RF | 11n HT20 MCS7 | 80 | mA |
Low-power consumption
| Parameter | Condition / Notes | Test Time | Unit |
| DTIM 1 10 | 260 | 1 min | uA |
| 444 | 370 | 1 min | uA |
ESD Specifications
| Item | Description | Value | Unit |
| Human Body Mode (HBM) | Electrostatic Discharge Tolerance under Human Body Model | +-2 | KV |
| CDM | Electrostatic Discharge Tolerance under Charged Device Model | +-0.5 | KV |
Module Use Precautions
When using the WIFI module from Uascent Technology, a certain tolerance should be reserved for the output current of the power supply. It is recommended that the output current of the power supply be equal to or greater than 500mA, and a suitable power supply IC package should be selected. When using LDO power, attention should be paid to thermal issues, and when using DC-DC power, attention should be paid to overshoot issues at the moment of power-on.
WiFi Specification.
| Features | Descriptions |
| Main Chipset | BEKEN : BK7238 |
| Operating Frequency | 2.412 tilda 2.462GHz |
| Operating Voltage | 3.0 tilda 3.6V |
| WIFI Standard | IEE 802.11b/g/n |
| PHY Data Rates | Wi-Fi: 802.11b: 11,5.5, 2, 1 Mbps 802.119: 54, 48, 36, 24, 18, 12, 9, 6 Mbps HT20 MCS0-MCS7 |
| Transmit Output Power | Wi-Fi: 802.11b@11Mbps 16£2dBm 802.11g@54Mbps 15+2dBm 802.11n@HT20 MCS7 14+2dBm |
| EVM | 802.11b /11Mbps: EVM =-10dB 802.119 /54Mbps: EVM =-25dB 802.11n /HT20 MCS7: EVM =-27dB |
| Receiver Sensivity | 802.11b@8% PER11Mbps < -88dBm |
| (HT20) | 802.11g@10% PER 54Mbps <-74dBm |
| 802.11n@10% PER MCS 7 <-71dBm | |
| Operating Channel | Wi-Fi 2.4GHz: 11: (Ch. 1-11) — United States(North America) 13: (Ch. 1-13) — Europe 14: (Ch. 1-14) — Japan |
| Antenna | PCB onboard antenna |
Bluetooth Specification.
| Features | Descriptions |
| Operating Frequency | 2.402~2.480GHz |
| BLE Version | 5.1 |
| Data rate | Typical : 1Mbps |
| Tx output power | 20dBm(Max) |
| RX sensivity (PER 1500 packet data -< 30.8% | -93dBm |
Pin Descriptions
Pin Outline
Pin Definition.
| Pin No. | Name | Type | Description | Voltage |
| 1 | P14 | I/O | GPIO14/SPlI SCK | |
| 2 | P16 | I/O | GPIO16/SPI_MOSI | |
| 3 | P28 | I/O | GPIO28/ADCA4 | |
| 4 | P22 | I/O | GPl0O22 | |
| 5 | P20 | I/O | GPIO20/ADC3 | |
| 6 | RX2 | I/O | GPIO1/UART_RX2/ADC5 | |
| 7 | TX2 | I/O | GPIO0/UART_TX2 | |
| 8 | P24 | I/O | GPI024/PWM4/12C SCL/ADC2 | |
| 9 | P26 | I/O | GPI10O26/PWM5/12C SDA/ADC1 | |
| 10 | P6 | I/O | GPIO6/CLK13M/PWMO/JTAG_TCK | |
| 11 | P07 | I/O | GPIO7/PWM1/JTAG_TMS | |
| 12 | P8 | I/O | GPIO8/PWM2/JTAG_TDI/CLK26M | |
| 13 | GND | P | Ground | |
| 14 | 3V3 | P | Supply 3.3V | 3.3V |
| 15 | TX1 | I/O | UART_TX1/GPIO11.Prohibit pull-up.The default state for MCU docking to the serial port needs to be confiaured as low level or hiah resistance state | |
| 16 | RX1 | I/O | UART_RX1/GPIO10.Prohibit pull-up.The default state for MCU docking to the serial port needs to be configured as low level or high resistance state. | |
| 17 | P23 | I/O | GPIO23 | |
| 18 | CEN | I/O | Reset pin | |
| 19 | P9 | I/O | GPIO9/PWMB/JTAG_TDO | |
| 20 | P17 | I/O | GPIO17/SPI_MISO/12C_SDA | |
| 21 | P15 | I/O | GPIO15/SPI_CSN/I2C_SCL |
Dimensions.
Module Picture.
Module Mechanical Dimensions.
PCB Layout Reference.
Antenna Information.
Antenna type.
This module antenna type is PCB on-board antenna with antenna gain of -1.3dBi (MAX)
Module layout considerations.
The UAMO087-A0 module shall be welded to the PCB. To obtain the best RF performance, there should be no copper laying, device, or wiring under the PCB onboard antenna. During PCB design, the corresponding area should be cleared, as shown in the following figure.
Environmental Requirements
Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : <2 times
Note
Note: Take and use the module, please insure the electrostatic protective measures.
- Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 C for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:
- The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 C, relative humidity: < 90% r.h.
- The module vacuum packing once opened, time limit of the assembly: Card:1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: = -30 C, = 60% r.h. Once opened, the workshop the preservation of life for 168 hours.
- Once opened, such as when not used up within 168 hours:
- The module must be again to remove the module moisture absorption.
- The baking temperature: 125 °C, 8 hours.
- After baking, put the right amount of desiccant to seal packages.
Humidity sensitive control.
Package.
Packaging Detail.
The module and the humidity indicator card are placed together in vacuum anti-static packaging, separated by a certain amount of paper, and neatly placed in the packaging box.The packaging must have reliable moisture-proof and anti-collision measures.
Transport regulations
In the process of logistics or express transportation, attention should be paid to handling with care to avoid direct rain and snow.
Disclaimer and copyright notice
All information in this document is provided according to the product’s status quo and is subject to change without notice.
The contents of this document disclaim any warranties, including any warranties of fitness for sale, fitness for a particular purpose, or non-infringement, and any warranties mentioned elsewhere in any proposal, specification, or sample.
This document is not liable for any infringement of patent rights arising from the use of the information contained in this document.
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All trademarks mentioned herein are the property of their respective owners.
Attention
Due to product version upgrades or other reasons, the content of this manual may change. Shenzhen Uascent Technology Co., Ltd. reserves the right to modify the content of this manual without any notice or prompt. If users need to obtain the latest product information, please request the final document from our company. This manual is intended only as a guide. Shenzhen Uascent Technology Co., Ltd. strives to provide the latest information in this manual but does not guarantee that the content is completely accurate.
None of the statements, information, or recommendations contained in this manual constitute any express or implied warranty.